Latest Trends in High-Speed Connectivity, High Current, and Heat Dissipation Technologies for the Data Center Market
A comparative explanation of technological evolution and the latest solutions. A free webinar hosted by Molex introducing advanced technologies for the rapidly expanding data center market.
We would like to introduce advanced technologies for the rapidly expanding data center market in a webinar hosted by Molex. ■ Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers In this webinar, we will provide a clear explanation while comparing the evolution of technology and the latest solutions, including: - High-speed connection technologies supporting 112Gbps/224Gbps - High-density mezzanine connections for AI-oriented GPUs - Power connections for high current applications and heat dissipation products. This content will serve as hints for product selection and problem-solving for those involved in the design and development of data center equipment. We encourage you to participate in this opportunity. 【Event Overview】 ■ Date: April 22, 2026 (Wednesday) 15:00 - 16:00 ■ Format: Zoom Webinar ■ Cost: Free (Pre-registration required) ■ Registration Deadline: April 21, 2026 (Tuesday) by 12:00 *For more details, please refer to the related links or feel free to contact us. A catalog of the lineup products is also available for download.
- Company：レスター 本社
- Price：Other
